Bonding across Multiple Circuits


For bandwidth hungry applications bonding brings presents the possibility to bring together multiple circuits and join them together to seem as one, high bandwidth, highly resilient, virtual link.

The multiple circuits come in to the customer premise and terminate at the Unified Bandwidth Management (UBM) appliance via a router or modem. Although it is recommended to use circuits of same type and speed, this is not essential. Xrio's unique and market leading IP bonding solution allow the aggregation of almost any type of access circuit.

In order to perform circuit bonding, the UBM client side device or CPE must be teamed with a central UBM appliance at the Service Provider or in your central site network.

Usually connected directly to a firewall or other gateway device, the Service Provider will route an 'IP block' to the customer premise. No Network Address Translation is used and all applications and services are supported. All available bandwidth of all circuits is used for both inbound and outbound communication making the bonded circuit before as if it's a single circuit.

As traffic arrives at the UBM from the network, the UBM will break up the data stream, packet by packet, simultaneously distributing over each circuit whilst at the same time adjusting to network conditions.

If a circuit fails during a data transmission, packets a simply retransmitted to the remaining circuits in seconds and thus eliminating down time.

The Benefits of a Bonded infrastructure are:
  • Achieve higher upload and download speed
  • Backup connection(s) for added resilience
  • Scalable bandwidth solution
  • Supports any Internet or WAN technology
  • Higher bandwidth capacity for voice and video applications

Via xrio


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